To support a rapid expansion program Hewlett Packard turned to Ramtech for construction of this 20,160 square foot office / research center for the support of new integrated circuit technology. The Type V wood structure was designed, manufactured and erected in 110 days.

Building & Construction Details: Permanent Modular Building

Project Size: 20,160 sq ft

Construction: IBC Type V Protected

Contract Type: Design-build Stipulated sum

Facility Use: Office / Technology Center

Description: Wood and steel framework Simulated stucco exterior Seismic foundation design

Completion: 110 days

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