To support a rapid expansion program Hewlett Packard turned to Ramtech for construction of this 20,160 square foot office / research center for the support of new integrated circuit technology. The Type V wood structure was designed, manufactured and erected in 110 days.
Building & Construction Details: Permanent Modular Building
Project Size: 20,160 sq ft
Construction: IBC Type V Protected
Contract Type: Design-build Stipulated sum
Facility Use: Office / Technology Center
Description: Wood and steel framework Simulated stucco exterior Seismic foundation design
Completion: 110 days